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High Density Foam Peeling MachineEYQ-P1900GC_ESUN INTERNATIONAL CO., LTD

EYQ-P1900GC

High Density Foam Peeling Machine

Application

EYQ-P1900GC is mainly used for round foam continuous first for long wafer cutting work, control cutting thickness by PLC. Products for mattresses, carpets, furniture and other industries, easy to operate, precise cutting.


Video

Technical data at a glance
ModelEYQ-P1900GC
Max cutiing foam   size(mm)φ1500*1900
Max cutting speed(m/min)30
Cutting thickness range(mm)2-30
Cutting precision(mm)±0.05
Cutting blade size(mm)10400*60*0.6
Thickness controlPLC
Blade frame lead-screwBall screw
Auto-collection winderYES
Collection winder speed adjustableYES
Control typePLC+ Touch Screen
Dust collection deviceYES
Hanging foam axis diameter(mm)70
Total power(kw)10


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